Thermal Form and Function

 




Currently, the existing blade form factor typically does not allow the addition of more fans and/or increase existing fans speed, due to packaging, reliability (MTBF), and specification limits. In the same time, the production schedule does not allow any substantial blade redesign due to the extra cost and development time required.

TFF is “untying” the development knot by introducing the Field Replaceable Cooling Unit (FRCU). Working directly with client’s engineering group, understanding their design limitations, we have always found a way to seamlessly blend our FRCU into the client’s blade envelope. Our design approach allows FRCU mounting to be adjusted to the existing air cooled blade mounting holes or to be “decoupled” from the PCB layout, due to the attachment to the blade enclosure.

Due to FRCU introduction air side impedance drops, downstream (to the condenser) heat is more equally distributed, fans’ speed/quantity reduces, while the blade dissipated power increases way beyond for what’s achieve able by the traditional air cooling.

Blade with loop
This shows how a TF&F 2U PLMC would fit into a blade 1.5" high. The TF&F PLMC retrofit for 1U blade with PLMC FRCU. PLMC dissipates more power than airflow cooling.


Blade demo
Field Replaceable Cooling Unit for Server Blade

1U PLMC model
This is a 1U PLMC model server mock-up.

1U PLMC model
When assembled, the cold plate mates with the Device Simulator (heater).

Blade with motherboard
TF&F system in blade with simulated mother board.