Interdisciplinary approach; Seamless integration.

 

We approach digital cooling at the intersection of three distinct disciplines: mechanical, computer, and thermal engineering. Our interdisciplinary approach informs our process each step of the way.

 

Our multi-disciplinary capabilities are not merely convenient but essential. Since our platform is the smallest, safest, and least-intrusive approach available, it calls for seamless integration at the design level. This is only possible because we speak your language. Our principal thermal engineers have hands-on experience with computer and mechanical engineering as well.  

 

“Engineering is done with numbers. Analysis without numbers is only an opinion.” 

—Akin’s Laws of Spacecraft Design

 

Inside Our Toolkit

 

• Creo Parametric (Pro/Engineer) is used for CAD modeling to design and integrate our systems.

 

• Computational Fluid Dynamics (CFD) using ANSYS IcePack simulates the interaction and behavior of fluids and gases under stress from thermal gradients or specific constraints. 

 

• Finite Element Analysis (FEA) is used to test structural integrity, performance, flow, and fatigue of a system.

 

• TF&F Proprietary Thermal Suite simulates and analyzes two-phase heat transfer and flow networks with the degree of precision and accuracy required by our customers. 

 

• When necessary we build Proof of Concept Hardware in-house at our lab. We run quantitative tests to verify the amount of heat being removed and demonstrate that performance specifications (size, weight, airflow, and device temperature) are being met.

 

• When it’s time for Mass-Production we work with our manufacturing partners at Parker Hannifin, the world’s leading manufacturer of precision-engineered products. Our systems are built at their Precision Cooling Division in New Haven, Indiana.

 

• We employ Six Sigma methodology and the TRIZ (Theory of Inventive Problem Solving) to deliver results that exceed expectations.