At Thermal Form & Function, we don’t believe that cooling should be a limitation that forces electronics designers to compromise on performance, density, or acoustic noise. We DO believe that an appropriate combination of technology and design can remove the current limits and provide headroom for years into the future.
Thermal control of electronic equipment has been a major design issue from the era of vacuum tubes through today’s multi-GHz sub-micron integrated circuits.
But now we have a solution...
Read more...
 Technology
TF&F ’s technology platform has wide applicability across markets (IT, telecommunications, military, electro-optics, industrial) as well as scalability in particular market segments. TF&F also provides
custom applications in thermal design and engineering services for cooling needs from 100W to 50kW through our Engineered Solutions product line.
Read more
about TF&F Technology here.
The Solution
Our solution is called Pumped Liquid Multiphase Cooling (PLMC) – an elegant, functional approach that uses advanced thermal engineering along with unique miniaturized system elements and available high-volume components to achieve
a system that is small, highly efficient and high performance
on numerous scales. From
single component level to
facility-wide applications, TF&F
has the solution.
Read more
about TF&F Solutions here.
"Form and function are a unity, two
sides of one coin. In order to enhance
function, appropriate form must exist or
be created..."
-Ida
P. Rolf, 1896-1979
|
