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 Thermal Form & Function (TF&F) is
engaged in the development and marketing
of a scalable, flexible, and
energy-efficient cooling technology
platform that can be applied to computer
and communications equipment from the
chip level through equipment rack and
data center thermal management systems.
View TF&F
Road Map.
Other applications include cooling of hybrid electric vehicles, battery systems, and ultra capacitors,
as well as power electronics for fixed and mobile systems and laser-based systems for medical use, telecommunications and the military.
News Item:
TFandF announces strategic partnership with
Parker-Hannifin
The performance limits of
conventional cooling techniques are
being reached in commercial and
military electronics, industrial and
medical devices, and electro-optical
systems. The thermal engineering
challenge is to:
- Maintain
critical device
temperatures at
appropriate levels.
- Handle
increasingly high
heat densities in
modules, boxes, and
racks.
- Economically
cool data centers
and central offices
despite
unprecedented (and
in some cases
unplanned-for)
levels of waste heat
generation.
Click here to read
about our
Solutions...
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