PC COOLING SYSTEM
PLMC-based cooling system enables
“silent” PCs without jeopardy of
having disastrous water leaks (for
electrical components). The latest
high performance multiple chip work
stations present the unique set of
thermal and packaging tasks. Air
flow management challenges thermal
designers to deal with conflicting
air flows, modifying computer
enclosures, employing faster, more
expensive higher RPM fans and
adaptive control systems - to
minimize acoustic problems.
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SERVER BLADE COOLING SYSTEM
1U and 2U Server Blades present one
of the highest cooling challenges in
the server industry due to the low
blade thickness, extremely tight
packaging, and evolutionary design
process, which very often requires
to stay with the original board
layout, while adding more power to
processors, memory, voltage
regulators, etc.
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LED PROJECTOR COOLING SYSTEM
High-power/brightness LED's in HD
projection applications create high
power density making it challenging
for air cooled application.
Insufficient cooling of LED chips
for the high brightness applications
limits the ability to achieve
continuously bright image.
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RACK/CABINET COOLING SYSTEM
Cabinet cooling is the next, higher level of the thermal management challenge. There are two traditional rack/cabinet cooling approaches: horizontal and vertical.
PLMC provides the highest COP
efficiency compared to any other
available liquid cooled systems
(Pumped Liquid Single Phase, Vapor
Compression Refrigeration, etc.).
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FACILITY LEVEL COOLING
TF&F PLMC has the ability to achieve very low Power Utilization Efficiency (PUE) =<1.08.
It does not require any chillers or any vapor compression.
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