Thermal Form and Function















Patents

See also: Patents

 2004 ASME International Mechanical Engineering Congress -
   Pumped Liquid Multiphase Cooling

 2005 ASME International Mechanical Engineering Congress -
   Thermal Design and Performance of Two-Phase Meso-Scale
   Heat Exchangers


 InterPACK 2007 - Analysis of Alternative Data Center Cooling
   Approaches


 2003 Rohsenow Symposium on Future Trends in Heat Transfer - Thermal Control of Electronics: Perspectives and Prospects

 TFandF Presentation - Advanced Cooling Using Meso-scale
   Evaporative Cold Plates



Hannemann, R.J. - “VAX 6000 Model 400 Physical Technology”, Digital Technology Journal, vol. 2(2), 64-73
(1990) (with J. Bartoszek, S. Hansen, R. McCarty, and J. Sweeney).

Hannemann, R.J. - “High Heat from a Small Package,” Mechanical Engineering (Oct, 1986) (with A. Bar-Cohen and
S. Oktay).

Hannemann, R.J. - “Analysis of Surface Mount Thermal and Thermal Stress Performance,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol. CHMT-6(3), 257-266 (1983) (with D. Waller and L. Fox).

Hannemann, R.J. - “Externally Pumped Rankine Cycle Thermal Transport Devices,” Progress in Aeronautics and Astronautics, vol. 70, 293-306 (1979).

Hannemann, R.J. - “Thermal Analysis and Design Considerations for a Dual-Beam Microwave Applicator for Hyperthermia Research,” Journal of Biomechanical Engineering, vol. 101, 151-156 (1979) (with
J. E. Robinson).

Hannemann, R.J. - “Surface Thickness Effects in Dropwise Condensation,” International Journal of Heat and Mass Transfer, vol. 21, 65-66 (1978).

Hannemann, R.J. - “Electronic System Thermal Design for Reliability,” IEEE Trans. On Reliability, vol.26(5), 306- 311 (1977).

Hannemann, R.J. - “Thin Film Conducting and Semiconducting Resistance Thermometers for Surface Temperature Measurement,” Trans. ASME: Journal of Engineering for Power, vol. 99(3), 385-390 (1977).

Hannemann, R.J. - “Design Equations for a Semi-Demountable Friction Activated Hermetic Feed-Through Seal,” The Review of Scientific Instruments, vol. 48(5), 567-569 (1977).

Hannemann, R.J. - “An Analysis of the Effect of Surface Thermal Conductivity on the Rate of Heat Transfer in Dropwise Condensation,” International Journal of Heat and Mass Transfer, vol. 19, 1299-1307 (1976) (with B. Mikic).

Hannemann, R.J. - “An Experimental Investigation Into the Effects of Surface Thermal Conductivity on the Rate of Heat Transfer in Dropwise Condensation,” International Journal of Heat and Mass Transfer, vol. 19, 1309-1317 (1976) (with B. Mikic).

Hannemann, R.J. - "Analysis of Alternative Data Center Cooling Approaches," ASME InterPACK 07, Vancouver, BC
(2007) (with H. Chu).

Hannemann, R.J. -"Thermal Design and Performance of Two-Phase Micro-Scale Heat Exchangers," ASME National Heat Transfer Conference, San Francisco, CA (2005) (with J. Marsala and M. Pitasi).

Hannemann, R.J. - "Pumped Liquid Multiphase Cooling," ASME IMECE 04, Anaheim, CA (2004) (with J. Marsala and M. Pitasi).

Hannemann, R.J. - “Heat Transfer in Microelectronic Components,” Cooling Techniques for Computers, Hemisphere, New York (1991) (with L. Fox and M. Mahalingham).

Hannemann, R.J. - “Physical Technology and the Air Cooling and Interconnection Limits for Mini- and Micro- Computers,” Advances in Thermal Modeling of Electronic Components and Systems, ASME Press, New York (1990).

 Hannemann, R.J. - “Interconnects for Highly Integrated Systems,” SPIE – The International Society for Optical Engineering – Symposium (1989).

Hannemann, R.J. - “The Impact of Physical Architecture on System Performance,” IEEE Computer Packaging Workshop, Brussels, Belgium (1987).

Hannemann, R.J. - “Physical Technology for VLSI Systems,” Proc. IEEE International Conference on Computer Design: VLSI in Computers, 48-53 (1986).

Hannemann, R.J. - “Two Phase Internal Cooling Technique for Electronic Packages,” ASME Heat Transfer Conference (1985) (with L. Fox and G. Kromann).

Hannemann, R.J. - “Physical Technology Performance Assessment,” IEEE Computer Elements Workshop (1984).

Hannemann, R.J. - “Microelectronic Device Thermal Resistance: A Format for Standardization,” Thermal Management Concepts in Microelectronic Packaging, The International Society of Hybrid Microelectronics, Silver Spring, MD (1984).

Hannemann, R.J. - “Computer Systems of the Eighties: The Impact of Physical Design,” in Advances in Computer Technology 1980, vol. 1, ASME, New York (1980).

Hannemann, R.J. - “An Investigation into Unsteady Two-Phase Depressurization of Vessels Through Orifices and Short Pipes,” ASME Paper 78-WA/HT-36 (1978) (with D. W. Sallet and M. Guhler.)

Hannemann, R.J. - “Unsteady Two-Phase Blowdown of a Flashing Liquid from a Finite Reservoir,” ICHMT 1978 International Seminar, Dubrovnik, Yugoslavia (1978) (with D. W. Sallet and M. Guhler).

Hannemann, R.J. - “Recent Advances in Dropwise Condensation Theory,” ASME Paper 77-WA/HT-21 (1977).

Yatskov, A. - "Red Storm/XT Supercomputer Cooling System Design and Optimization", Semitherm, (2007).

Yatskov, A. - "Optimization of Skilsaw Gear Housing", Proceedings of ANSYS conference: "Simulating Real Life: Software with No Boundaries", Volume II (1998).

Yatskov, A. - "Design and Verification of Cray XT-4 Supercomputer Cooling System", Proceedings of InterPACK (2007).



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